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 AP9575H/J
Advanced Power Electronics Corp.
Lower On-resistance Simple Drive Requirement Fast www..com Switching Characteristic G S D
P-CHANNEL ENHANCEMENT MODE POWER MOSFET
BVDSS RDS(ON) ID
-60V 90m -15A
Description
The TO-252 package is universally preferred for all commercialindustrial surface mount applications and suited for low voltage applications such as DC/DC converters. The through-hole version (AP9575J) is available for low-profile applications.
G D S GD S
TO-252(H)
TO-251(J)
Absolute Maximum Ratings
Symbol VDS VGS ID@TC=25 ID@TC=100 IDM PD@TC=25 TSTG TJ Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current
1
Rating -60 25 -15 -9.5 45 36 0.29 -55 to 150 -55 to 150
Units V V A A A W W/
Total Power Dissipation Linear Derating Factor Storage Temperature Range Operating Junction Temperature Range
Thermal Data
Symbol Rthj-c Rthj-a Parameter Thermal Resistance Junction-case Thermal Resistance Junction-ambient Max. Max. Value 3.5 110 Units /W /W
Data and specifications subject to change without notice
200211041
AP9575H/J
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol BVDSS
BVDSS/Tj
Parameter Drain-Source Breakdown Voltage
Test Conditions VGS=0V, ID=-250uA
Min. -60 -1 -
Typ. -0.06
Max. Units 90 120 -3 -1 -25 100 27 V V/ m m V S uA uA nA nC nC nC ns ns ns ns pF pF pF
Breakdown Voltage Temperature Coefficient Reference to 25, ID=-1mA
RDS(ON)
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Static Drain-Source On-Resistance2
VGS=-10V, ID=-12A VGS=-4.5V, ID=-9A
14 17 5 6 10 19 46 53 160 100
VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss
Gate Threshold Voltage Forward Transconductance
Drain-Source Leakage Current (Tj=25 C) Drain-Source Leakage Current (Tj=150 C)
o o
VDS=VGS, ID=-250uA VDS=-10V, ID=-9A VDS=-60V, VGS=0V VDS=-48V, VGS=0V VGS= 25V ID=-9A VDS=-48V VGS=-4.5V VDS=-30V ID=-9A RG=3.3,VGS=-10V RD=3.3 VGS=0V VDS=-25V f=1.0MHz
Gate-Source Leakage Total Gate Charge
2
Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance
2
1660 2660
Source-Drain Diode
Symbol VSD trr Qrr Parameter Forward On Voltage
2 2
Test Conditions IS=-9A, VGS=0V IS=-9A, VGS=0V, dI/dt=-100A/s
Min. -
Typ. 60 159
Max. Units -1.2 V ns nC
Reverse Recovery Time
Reverse Recovery Charge
Notes:
1.Pulse width limited by safe operating area. 2.Pulse width <300us , duty cycle <2%.
AP9575H/J
55
40
50
T C =25 C
45
o
-ID , Drain Current (A)
40
35
-ID , Drain Current (A)
-10V -6.0V -5.0V -4.5V
35
TC=150 C
o
30
-10V -6.0V -5.0V -4.5V
25
30
20
25
20
15
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15
V G =-3.0V
10 5
10
V G =-3.0V
5
0
0 0 2 4 6 8 10 0 2 4 6 8 10 12
-V DS , Drain-to-Source Voltage (V)
-V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
105
2.0
100
I D = -9 A T C =25 Normalized R DS(ON)
1.8
I D =- 12 A V G =-10V
1.6
RDS(ON) (m )
1.4
95
1.2
90
1.0
0.8
85
0.6
80
0.4
3
5
7
9
11
-50
0
50
100
150
-V GS , Gate-to-Source Voltage (V)
T j , Junction Temperature ( C)
o
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance v.s. Junction Temperature
2.5
15.0
12.5
2.0
10.0
7.5
-VGS(th) (V)
-IS(A)
1.5
T j =150 o C
5.0
T j =25 o C
1.0
2.5
0.0
0.5 0 0.2 0.4 0.6 0.8 1 1.2 1.4 -50 0 50 100 150
-V SD , Source-to-Drain Voltage (V)
T j , Junction Temperature ( o C)
Fig 5. Forward Characteristic of
Reverse Diode
Fig 6. Gate Threshold Voltage v.s. Junction Temperature
AP9575H/J
f=1.0MHz
12 10000
-VGS , Gate to Source Voltage (V)
10
I D = -9A V DS = -48V C iss
8
1000
6
C (pF)
C oss
100
4
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C rss
2
0 0 10 20 30 40
10 1 5 9 13 17 21 25 29
Q G , Total Gate Charge (nC)
-V DS , Drain-to-Source Voltage (V)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
100
1
-ID (A)
10
100us
Normalized Thermal Response (Rthjc)
Duty factor=0.5
0.2
0.1
1ms
1
0.1
0.05
T C =25 o C Single Pulse
0.1
0.1 1 10
10ms 100ms DC
PDM
0.02
t T
Duty factor = t/T Peak Tj = PDM x Rthjc + TC
0.01
Single Pulse
0.01
100 1000
0.00001
0.0001
0.001
0.01
0.1
1
-V DS , Drain-to-Source Voltage (V)
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
VDS 90%
VG QG -4.5V QGS QGD
10% VGS td(on) tr td(off) tf Charge Q
Fig 11. Switching Time Waveform
Fig 12. Gate Charge Waveform


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